Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10393646 | Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same | Dong-Kil Shin, Min-Kyu Kang, Gyu Jei LEE | 2019-08-27 |
| 9945772 | Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same | Dong-Kil Shin, Min-Kyu Kang, Gyu Jei LEE | 2018-04-17 |
| 8810309 | Stack package and method for selecting chip in stack package | Dae Woong Lee, Yu Gyeong Hwang, Jae Hyun Son, Tae-Min Kang, Byoung Do Lee +1 more | 2014-08-19 |
| 8164200 | Stack semiconductor package and method for manufacturing the same | Tae-Min Kang, You Kyung Hwang, Jae Hyun Son, Dae Woong Lee, Byoung Do Lee +1 more | 2012-04-24 |