Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9390997 | Semiconductor chip and stacked type semiconductor package having the same | Jong Hoon Kim, Jae Hyun Son, Kuk-jin Chun, Woong Kyu Choi | 2016-07-12 |
| 8810309 | Stack package and method for selecting chip in stack package | Dae Woong Lee, Yu Gyeong Hwang, Jae Hyun Son, Tae-Min Kang, Chul Keun Yoon +1 more | 2014-08-19 |
| 8680688 | Stack package having flexible conductors | Tae-Min Kang, You Kyung Hwang, Jae Hyun Son, Dae Woong Lee, Yu Hwan Kim | 2014-03-25 |
| 8288873 | Stack package having flexible conductors | Tae-Min Kang, You Kyung Hwang, Jae Hyun Son, Dae Woong Lee, Yu Hwan Kim | 2012-10-16 |
| 8164200 | Stack semiconductor package and method for manufacturing the same | Tae-Min Kang, You Kyung Hwang, Jae Hyun Son, Dae Woong Lee, Chul Keun Yoon +1 more | 2012-04-24 |