Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11042855 | Electronic device and remittance method thereof | Shin Wook Kim | 2021-06-22 |
| 10357806 | Substrate treating apparatus and method | Jong Han Kim, Yoon Jong Ju, Edwin Lee, Seong-soo Lee | 2019-07-23 |
| 9748118 | Substrate treating apparatus | Jung Bong Choi, Ho Jong HWANG | 2017-08-29 |
| 8810309 | Stack package and method for selecting chip in stack package | Dae Woong Lee, Yu Gyeong Hwang, Jae Hyun Son, Tae-Min Kang, Chul Keun Yoon +1 more | 2014-08-19 |
| 8680688 | Stack package having flexible conductors | Tae-Min Kang, You Kyung Hwang, Jae Hyun Son, Dae Woong Lee, Byoung Do Lee | 2014-03-25 |
| 8288873 | Stack package having flexible conductors | Tae-Min Kang, You Kyung Hwang, Jae Hyun Son, Dae Woong Lee, Byoung Do Lee | 2012-10-16 |
| 8164200 | Stack semiconductor package and method for manufacturing the same | Tae-Min Kang, You Kyung Hwang, Jae Hyun Son, Dae Woong Lee, Chul Keun Yoon +1 more | 2012-04-24 |