TK

Tae-Min Kang

Samsung: 71 patents #947 of 75,807Top 2%
SH Sk Hynix: 16 patents #452 of 4,849Top 10%
Overall (All Time): #18,743 of 4,157,543Top 1%
88
Patents All Time

Issued Patents All Time

Showing 25 most recent of 88 patents

Patent #TitleCo-InventorsDate
12384104 3D over-printing device and method Jin-Soo Kim 2025-08-12
RE47781 Organic electro luminescent display and method for fabricating the same Myung-Won Song, Seong-Taek Lee, Jin-Woo Park, Hun Kim 2019-12-24
10101508 Apparatus for forming an optical pattern Young-Suk Cho 2018-10-16
9897539 Apparatus and method for measuring deposition rate Seung-Mook Lee, Young-Suk Cho 2018-02-20
9659833 Semiconductor packages, methods of manufacturing the same, electronic systems including the same, and memory cards including the same Dae Woong Lee, Han Jun Bae 2017-05-23
9595674 Method of manufacturing mask Young-Suk Cho 2017-03-14
9543251 Semiconductor chip and semiconductor package having the same Dae Woong Lee, Jong Hoon Kim 2017-01-10
9272364 Laser irradiation device and laser induced thermal imaging method Jae Ho Lee, Seong-Taek Lee 2016-03-01
9170484 Mask and method of manufacturing the same 2015-10-27
9129922 Organic light-emitting display device and method of manufacturing the same Jin-Woo Park, Noh-Min Kwak, Seung-Mook Lee 2015-09-08
9054314 Laser induced thermal imaging mask, laser irradiation apparatus including the same, and method of manufacturing organic light emitting device by using the same Jin-Won Sun, Sok Won Noh, Min-Chul Suh 2015-06-09
8953138 Flat panel display and method of fabricating the same Jae Ho Lee, Seong-Taek Lee, Jin-Soo Kim 2015-02-10
8946593 Laser patterning process Jae Ho Lee, Seong-Taek Lee 2015-02-03
8922463 Organic light-emitting display apparatus Sok Won Noh, Jae Ho Lee, Jin-Won Sun, Min-Chul Suh 2014-12-30
8847377 Stacked wafer level package having a reduced size Jong Hoon Kim, Min Suk Suh, Seung Taek YANG, Seung Hyun Lee 2014-09-30
8836118 Electronic device packages including bump buffer spring pads and methods of manufacturing the same 2014-09-16
8810309 Stack package and method for selecting chip in stack package Dae Woong Lee, Yu Gyeong Hwang, Jae Hyun Son, Chul Keun Yoon, Byoung Do Lee +1 more 2014-08-19
8741535 Laser irradiation device and method of fabricating organic light emitting display device using the same Jae Ho Lee, Seong-Taek Lee, Mu-Hyun Kim, Nam-Choul Yang, Noh-Min Kwak +4 more 2014-06-03
8729686 Semiconductor package and a method for selecting a chip in the semiconductor package 2014-05-20
8699002 Laser irradiation device and method of manufacturing organic light emitting diode display device using the same Seung-Mook Lee, Do-Young Kim, Beom Joon Kim 2014-04-15
8680688 Stack package having flexible conductors You Kyung Hwang, Jae Hyun Son, Dae Woong Lee, Byoung Do Lee, Yu Hwan Kim 2014-03-25
8617329 Method of fabricating organic light emitting display Jae Ho Lee, Jin-Soo Kim, Seong-Taek Lee 2013-12-31
8613989 Film donor device for laser induced thermal imaging Jin-Soo Kim, Mu-Hyun Kim, Sun Hoe Kim, Noh-Min Kwak, Sang-Bong Lee +7 more 2013-12-24
8581270 Organic light-emitting display apparatus Jin-Woo Park, Myung-Jong Jung, Sang-Woo Pyo, Beom Joon Kim, Hyo-Yeon Kim 2013-11-12
8575649 Donor substrate and method of fabricating organic light emitting diode using the same Jin-Woo Park, Myung-Jong Jung, Sang-Woo Pyo, Hyo-Yeon Kim, Dae Hoon KIM 2013-11-05