Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090252 | Package-on-package type semiconductor device including fan-out memory package | Sang Eun Lee | 2018-10-02 |
| 9793217 | Package-on-package type semiconductor device which is realized through applying not a TSV technology but a fan-out wafer level package technology | Sang Eun Lee | 2017-10-17 |
| 9716017 | Semiconductor packages including interposer and methods of manufacturing the same | Tac Keun OH | 2017-07-25 |
| 9418875 | Substrate including a dam for semiconductor package, semiconductor package using the same, and manufacturing method thereof | — | 2016-08-16 |
| 9257413 | Stack packages including diffusion barriers over sidewalls of through via electrodes and methods of manufacturing the same | Jong Hoon Kim, Tac Keun OH, Song NA | 2016-02-09 |
| 9171813 | Substrate including a dam for semiconductor package, semiconductor package using the same, and manufacturing method thereof | — | 2015-10-27 |
| 9166095 | Image sensor module and method of manufacturing the same | Jong Hoon Kim | 2015-10-20 |
| 8847377 | Stacked wafer level package having a reduced size | Jong Hoon Kim, Min Suk Suh, Seung Hyun Lee, Tae-Min Kang | 2014-09-30 |
| 8502366 | Semiconductor package | — | 2013-08-06 |
| 8395245 | Semiconductor package module | Jong Hoon Kim, Min Suk Suh, Seong Cheol Kim, Seung Hyun Lee | 2013-03-12 |
| 8383447 | Reverse image sensor module and method for manufacturing the same | — | 2013-02-26 |
| 8361838 | Semiconductor package and method for manufacturing the same via holes in semiconductor chip for plurality stack chips | Min Suk Suh, Seung Hyun Lee, Jong Hoon Kim | 2013-01-29 |
| 8357959 | Image sensor module and method of manufacturing the same | Jong Hoon Kim | 2013-01-22 |
| 8222083 | Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same | Seung Hyun Lee | 2012-07-17 |
| 8217434 | Semiconductor package having through-electrodes which are electrically connected with internal circuit patterns formed in a semiconductor chip and method for manufacturing the same | Ho Young SON, Jun-Gi Choi | 2012-07-10 |
| 8178975 | Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers | Shin Young Park | 2012-05-15 |
| 8159066 | Semiconductor package having a heat dissipation member | — | 2012-04-17 |
| 8154098 | Reverse image sensor module and method for manufacturing the same | — | 2012-04-10 |
| 8049341 | Semiconductor package and method for manufacturing the same | Min Suk Suh, Seung Hyun Lee, Jong Hoon Kim | 2011-11-01 |
| 8018043 | Semiconductor package having side walls and method for manufacturing the same | Min Suk Suh, Seung Hyun Lee, Jong Hoon Kim | 2011-09-13 |
| 7884465 | Semiconductor package with passive elements embedded within a semiconductor chip | — | 2011-02-08 |
| 7859115 | Semiconductor package for improving characteristics for transmitting signals and power | Jong Hoon Kim, Min Suk Suh | 2010-12-28 |
| 7847419 | Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers | Shin Young Park | 2010-12-07 |
| 7834437 | Semiconductor package with passive elements | — | 2010-11-16 |
| 7795139 | Method for manufacturing semiconductor package | Kwon Whan Han, Chang Jun Park, Min Suk Suh, Seong Cheol Kim, Sung Min Kim +3 more | 2010-09-14 |