Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7728419 | Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same | Seung Hyun Lee | 2010-06-01 |
| 7652347 | Semiconductor package having embedded passive elements and method for manufacturing the same | — | 2010-01-26 |
| 7629682 | Wafer level package configured to compensate size difference in different types of packages | Qwan Ho CHUNG | 2009-12-08 |
| 7498199 | Method for fabricating semiconductor package | — | 2009-03-03 |
| 7429792 | Stack package with vertically formed heat sink | Ha Na Lee | 2008-09-30 |