Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9609742 | Electrical characteristics of package substrates and semiconductor packages including the same | Eul Chul Jang, Sang Joon LIM, Sung Woo Han | 2017-03-28 |
| 9412716 | Semiconductor package and method for manufacturing the same | Jin Ho Bae, Seong Kweon Ha, Jong Hyun Kim, Bok Gyu MIN, Jae Won Shin | 2016-08-09 |
| 9368456 | Semiconductor package having EMI shielding and method of fabricating the same | — | 2016-06-14 |
| 9305895 | Substrates having ball lands, semiconductor packages including the same, and methods of fabricating semiconductor packages including the same | Jong Woo Yoo | 2016-04-05 |
| 9252136 | Package stacked device | Seung Jee KIM | 2016-02-02 |
| 9209146 | Electronic device packages having bumps and methods of manufacturing the same | Seung Jee KIM, Jong Hyun Nam, Si-Han Kim, Sang Yong Lee, Seong Cheol Shin | 2015-12-08 |
| 9209150 | Embedded packages, methods of fabricating the same, electronic systems including the same, and memory cards including the same | Sang Yong Lee, Seung Jee KIM, Jong Hyun Nam, Si-Han Kim | 2015-12-08 |
| 9111820 | Embedded package and method for manufacturing the same | — | 2015-08-18 |
| 8907487 | Electronic device packages having bumps and methods of manufacturing the same | Seung Jee KIM, Jong Hyun Nam, Si-Han Kim, Sang Yong Lee, Seong Cheol Shin | 2014-12-09 |
| 8823183 | Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor package | Ki Young Kim, Sung Ho Hyun, Myung Gun PARK, Jin Ho Bae | 2014-09-02 |
| 8796834 | Stack type semiconductor package | Jin Ho Bae, Woong Sun LEE | 2014-08-05 |
| 8710652 | Embedded package and method for manufacturing the same | — | 2014-04-29 |
| 8461696 | Substrate for semiconductor package, semiconductor package including the same, and stack package using the semiconductor package | Kyu Won Lee | 2013-06-11 |
| 8445322 | Method of fabricating semiconductor package | Woong Sun LEE | 2013-05-21 |
| 8441116 | Semiconductor package having substrate for high speed semiconductor package | Woong Sun LEE, Il Hwan Cho, Sang Joon LIM, Jong Woo Yoo, Jin Ho Bae +1 more | 2013-05-14 |
| 8399294 | Semiconductor package for discharging heat and method for fabricating the same | — | 2013-03-19 |
| 8343803 | Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same | — | 2013-01-01 |
| 8264087 | Semiconductor package for discharging heat and method for fabricating the same | — | 2012-09-11 |
| 8129627 | Circuit board having semiconductor chip | Woong Sun LEE, Ki Young Kim | 2012-03-06 |
| 8053879 | Stacked semiconductor package and method for fabricating the same | Woong Sun LEE | 2011-11-08 |
| 8030739 | Semiconductor package having chip selection through electrodes and stacked semiconductor package having the same | — | 2011-10-04 |
| 7928535 | Semiconductor device and semiconductor package having the same | Yeo Song Yun, Kyoung Sook Park | 2011-04-19 |
| 7858520 | Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same | — | 2010-12-28 |
| 7855437 | Semiconductor device and semiconductor package having the same | Yeo Song Yun, Kyoung Sook Park | 2010-12-21 |
| 7847379 | Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same | — | 2010-12-07 |