Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8796834 | Stack type semiconductor package | Jin Ho Bae, Qwan Ho CHUNG | 2014-08-05 |
| 8618637 | Semiconductor package using through-electrodes having voids | Han Jun Bae | 2013-12-31 |
| 8558380 | Stack package and method for manufacturing the same | Si-Han Kim | 2013-10-15 |
| 8445322 | Method of fabricating semiconductor package | Qwan Ho CHUNG | 2013-05-21 |
| 8441116 | Semiconductor package having substrate for high speed semiconductor package | Qwan Ho CHUNG, Il Hwan Cho, Sang Joon LIM, Jong Woo Yoo, Jin Ho Bae +1 more | 2013-05-14 |
| 8399998 | Semiconductor package requiring reduced manufacturing processes | Ki Young Kim, Sung Ho Hyun, Myung Geun Park | 2013-03-19 |
| 8129627 | Circuit board having semiconductor chip | Qwan Ho CHUNG, Ki Young Kim | 2012-03-06 |
| 8053879 | Stacked semiconductor package and method for fabricating the same | Qwan Ho CHUNG | 2011-11-08 |
| 7880093 | 3-dimensional substrate for embodying multi-packages and method of fabricating the same | — | 2011-02-01 |
| 7859108 | Flip chip package and method for manufacturing the same | Il Hwan Cho, Myung Geun Park, Cheol Ho JOH, Eun Hye DO, Ki Young Kim +2 more | 2010-12-28 |
| 7387910 | Method of bonding solder pads of flip-chip package | Jin Yu | 2008-06-17 |
| 6110276 | Method for making n-type semiconductor diamond | Jin Yu, Jung Keun Kim | 2000-08-29 |