Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996392 | Semiconductor package including stacked semiconductor chips | Jong Hoon Kim | 2024-05-28 |
| 11664351 | Semiconductor package including stacked semiconductor chips | Jong Hoon Kim | 2023-05-30 |
| 10903189 | Stack packages including stacked semiconductor dies | — | 2021-01-26 |
| 9679865 | Substrate for semiconductor package and semiconductor package having the same | — | 2017-06-13 |
| 9305912 | Stack package and method for manufacturing the same | Hee Min SHIN, Cheol Ho JOH, Ji Eun Kim, Kyu Won Lee | 2016-04-05 |
| 9082634 | Stack package and method for manufacturing the same | Hee Min SHIN, Cheol Ho JOH, Ji Eun Kim, Kyu Won Lee | 2015-07-14 |
| 8564141 | Chip unit and stack package having the same | Kyu Won Lee, Cheol Ho JOH, Ji Eun Kim, Hee Min SHIN | 2013-10-22 |
| 8476751 | Stacked semiconductor package and method for manufacturing the same | Kyu Won Lee, Cheol Ho JOH, Ji Eun Kim, Hee Min SHIN | 2013-07-02 |
| 7859108 | Flip chip package and method for manufacturing the same | Woong Sun LEE, Il Hwan Cho, Myung Geun Park, Cheol Ho JOH, Ki Young Kim +2 more | 2010-12-28 |