Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842809 | Semiconductor packages having EMI shielding parts and methods of fabricating the same | Ki Ill MOON, Myeong Seob KIM | 2017-12-12 |
| 9659909 | Semiconductor packages including flexible wing interconnection substrate | Mi Young Kim | 2017-05-23 |
| 9305912 | Stack package and method for manufacturing the same | Cheol Ho JOH, Eun Hye DO, Ji Eun Kim, Kyu Won Lee | 2016-04-05 |
| 9093441 | Semiconductor packages including semiconductor chips having protrusions and methods of fabricating the same | Ji Eun Kim, Cheol Ho JOH, Kyu Won Lee, Chong Ho Cho | 2015-07-28 |
| 9082634 | Stack package and method for manufacturing the same | Cheol Ho JOH, Eun Hye DO, Ji Eun Kim, Kyu Won Lee | 2015-07-14 |
| 8951810 | Methods for forming interconnection line using screen printing technique | Kyu Won Lee, Cheol Ho JOH, Ji Eun Kim, Chong Ho Cho | 2015-02-10 |
| 8564141 | Chip unit and stack package having the same | Kyu Won Lee, Cheol Ho JOH, Eun Hye DO, Ji Eun Kim | 2013-10-22 |
| 8476751 | Stacked semiconductor package and method for manufacturing the same | Kyu Won Lee, Cheol Ho JOH, Eun Hye DO, Ji Eun Kim | 2013-07-02 |