Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842809 | Semiconductor packages having EMI shielding parts and methods of fabricating the same | Myeong Seob KIM, Hee Min SHIN | 2017-12-12 |
| 9515052 | Semiconductor package including a step type substrate | Kyu Won Lee, Cheol Woo Han | 2016-12-06 |
| 7115442 | Ball grid array package with stacked center pad chips and method for manufacturing the same | Hyung Gil Baik | 2006-10-03 |
| 6841863 | Ball grid array package with stacked center pad chips and method for manufacturing the same | Hyung Gil Baik | 2005-01-11 |
| 6818474 | Method for manufacturing stacked chip package | Ji Yon Kim | 2004-11-16 |