Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7115442 | Ball grid array package with stacked center pad chips and method for manufacturing the same | Ki Ill MOON | 2006-10-03 |
| 6841863 | Ball grid array package with stacked center pad chips and method for manufacturing the same | Ki Ill MOON | 2005-01-11 |
| 6677181 | Method for fabricating stacked chip package device | Myung Geun Park, Chang Jun Park, Nam Soo Lee, Yoon-hwa Choi | 2004-01-13 |
| 6316825 | Chip stack package utilizing a connecting hole to improve electrical connection between leadframes | Myung Geun Park, Chang Jun Park, Nam Soo Lee, Yoon-hwa Choi | 2001-11-13 |