Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058735 | Wafer-level chip scale package having stud bump and method for fabricating the same | Sang-Do Lee | 2011-11-15 |
| 7659531 | Optical coupler package | Yong-suk Kwon, Maria Clemens Y. Quinones | 2010-02-09 |
| 7541668 | Package frame and semiconductor package using the same | — | 2009-06-02 |
| 7315077 | Molded leadless package having a partially exposed lead frame pad | Shi-baek Nam, O-seob Jeon, Rajeev Joshi, Maria Cristina Estacio | 2008-01-01 |
| 6677181 | Method for fabricating stacked chip package device | Myung Geun Park, Chang Jun Park, Nam Soo Lee, Hyung Gil Baik | 2004-01-13 |
| 6621152 | Thin, small-sized power semiconductor package | Shi-baek Nam | 2003-09-16 |
| 6316825 | Chip stack package utilizing a connecting hole to improve electrical connection between leadframes | Myung Geun Park, Chang Jun Park, Nam Soo Lee, Hyung Gil Baik | 2001-11-13 |
| 6297543 | Chip scale package | Sung Hak Hong, Jong Tae Moon, Chang Jun Park | 2001-10-02 |
| 6075284 | Stack package | Nam Soo Lee | 2000-06-13 |