Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12411003 | Apparatus for wafer placement teaching and method for wafer placement teaching using the same | Chung Woo Lee, Tae Dong PARK, Jin Hwan Kim | 2025-09-09 |
| 11479112 | Fuel tank venting system for hybrid vehicle | Chang Han Kim, Man Seok Oh, Seok Lae Kim, Jong Ki Kim | 2022-10-25 |
| 9982623 | Apparatus and method for preventing overflow of fuel from vehicle fuel tank | Keun Soo Kim, June Young Park, Seung-Kyun Lee, Chang Han Park | 2018-05-29 |
| 9273645 | Fluid heating device and vehicle fuel system using the same | Myeong Hwan Kim, Chang Han Kim | 2016-03-01 |
| 9163593 | Fuel heating device for improving cold start performance of flex fuel vehicle | Chang Han Kim, Myeong Hwan Kim, Jae Min Lee | 2015-10-20 |
| 8869778 | Fuel supply system of vehicle | Chang Han Kim, Myeong Hwan Kim | 2014-10-28 |
| 8643466 | Method and system for setting security of a portable terminal | Ju Yong CHOI | 2014-02-04 |
| 8394717 | Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same | — | 2013-03-12 |
| D675929 | Container for food packaging | Hyun Wook LEE, Na Young Yim | 2013-02-12 |
| 8358016 | Semiconductor package having an internal cooling system | Min Suk Suh | 2013-01-22 |
| 8338921 | Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same | Kwon Whan Han, Seong Cheol Kim, Sung Min Kim, Hyeong-Seok Choi, Ha Na Lee +2 more | 2012-12-25 |
| 8232642 | Printed circuit board | Seong Cheol Kim | 2012-07-31 |
| 8159065 | Semiconductor package having an internal cooling system | Min Suk Suh | 2012-04-17 |
| 8044516 | Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same | — | 2011-10-25 |
| 7989264 | Warpage resistant semiconductor package and method for manufacturing the same | — | 2011-08-02 |
| 7898834 | Semiconductor chip with chip selection structure and stacked semiconductor package having the same | Sung Min Kim, Kwon Whan Han, Seong Cheol Kim, Ha Na Lee | 2011-03-01 |
| 7859102 | Multi-layer stacked wafer level semiconductor package module | Sung Min Kim, Kwon Whan Han, Seong Cheol Kim, Hyeong-Seok Choi, Ha Na Lee | 2010-12-28 |
| 7795139 | Method for manufacturing semiconductor package | Kwon Whan Han, Min Suk Suh, Seong Cheol Kim, Sung Min Kim, Seung Taek YANG +3 more | 2010-09-14 |
| 7795073 | Method for manufacturing stack package using through-electrodes | Kwon Whan Han, Seong Cheol Kim, Sung Min Kim, Hyeong-Seok Choi, Ha Na Lee | 2010-09-14 |
| 7795718 | Warpage resistant semiconductor package and method for manufacturing the same | — | 2010-09-14 |
| 7446405 | Wafer level chip scale package (WLCSP) with high reliability against thermal stress | Jong Hoon Kim, Min Suk Suh, Kwon Whan Han, Seong Cheol Kim | 2008-11-04 |
| 6677181 | Method for fabricating stacked chip package device | Myung Geun Park, Nam Soo Lee, Hyung Gil Baik, Yoon-hwa Choi | 2004-01-13 |
| 6316825 | Chip stack package utilizing a connecting hole to improve electrical connection between leadframes | Myung Geun Park, Nam Soo Lee, Hyung Gil Baik, Yoon-hwa Choi | 2001-11-13 |
| 6297543 | Chip scale package | Sung Hak Hong, Jong Tae Moon, Yoon-hwa Choi | 2001-10-02 |