Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770445 | Methods of fabricating semiconductor packages including reinforcement top die | — | 2020-09-08 |
| 9099456 | Package of electronic device including connecting bump, system including the same and method for fabricating the same | — | 2015-08-04 |
| 8922000 | Chip carriers, semiconductor devices including the same, semiconductor packages including the same, and methods of fabricating the same | — | 2014-12-30 |
| 8836054 | Semiconductor chip capable of improving mounting reliability and semiconductor package having the same | — | 2014-09-16 |
| 8586983 | Semiconductor chip embedded with a test circuit | — | 2013-11-19 |
| 8441098 | Semiconductor package | — | 2013-05-14 |
| 8399355 | Stacked semiconductor package and method for manufacturing the same | — | 2013-03-19 |
| 8338921 | Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same | Chang Jun Park, Seong Cheol Kim, Sung Min Kim, Hyeong-Seok Choi, Ha Na Lee +2 more | 2012-12-25 |
| 7898834 | Semiconductor chip with chip selection structure and stacked semiconductor package having the same | Sung Min Kim, Chang Jun Park, Seong Cheol Kim, Ha Na Lee | 2011-03-01 |
| 7880311 | Stacked semiconductor package and method for manufacturing the same | — | 2011-02-01 |
| 7859102 | Multi-layer stacked wafer level semiconductor package module | Sung Min Kim, Chang Jun Park, Seong Cheol Kim, Hyeong-Seok Choi, Ha Na Lee | 2010-12-28 |
| 7834463 | Stack package having pattern die redistribution | Sung Min Kim, Min Suk Suh | 2010-11-16 |
| 7795073 | Method for manufacturing stack package using through-electrodes | Chang Jun Park, Seong Cheol Kim, Sung Min Kim, Hyeong-Seok Choi, Ha Na Lee | 2010-09-14 |
| 7795139 | Method for manufacturing semiconductor package | Chang Jun Park, Min Suk Suh, Seong Cheol Kim, Sung Min Kim, Seung Taek YANG +3 more | 2010-09-14 |
| 7705457 | Wafer level semiconductor package and method for manufacturing the same | — | 2010-04-27 |
| 7691748 | Through-silicon via and method for forming the same | — | 2010-04-06 |
| 7595268 | Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same | — | 2009-09-29 |
| 7468550 | High-performance semiconductor package | — | 2008-12-23 |
| 7446405 | Wafer level chip scale package (WLCSP) with high reliability against thermal stress | Jong Hoon Kim, Min Suk Suh, Chang Jun Park, Seong Cheol Kim | 2008-11-04 |