Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322681 | Semiconductor chip including through electrode, and semiconductor package including the same | Seung Hwan Kim, Hyun Chul SEO, Moon Un Hyun | 2025-06-03 |
| 11764128 | Semiconductor chip including through electrode, and semiconductor package including the same | Seung Hwan Kim, Hyun Chul SEO, Moon Un Hyun | 2023-09-19 |
| 11417618 | Semiconductor device including redistribution layer and method for fabricating the same | Seung Hwan Kim, Hyun Chul SEO, Shin Young Park | 2022-08-16 |
| 10991598 | Methods of fabricating semiconductor packages including circuit patterns | Hyun Chul SEO, Seang Hwan Kim | 2021-04-27 |
| 10050019 | Method of manufacturing wafer level package and wafer level package manufactured thereby | Tae Hoon Kim, Jong Hoon Kim, Dae Won Kim | 2018-08-14 |
| 9922965 | Manufacturing methods semiconductor packages including through mold connectors | Jong Hoon Kim, Ki Jun SUNG, Young Geun Yoo | 2018-03-20 |
| 9847322 | Semiconductor packages including through mold ball connectors and methods of manufacturing the same | Ki Jun SUNG, Jong Hoon Kim, Yeon Seung Jung | 2017-12-19 |
| 9842822 | Semiconductor packages with socket plug interconnection structures | — | 2017-12-12 |
| 9837360 | Wafer level packages and electronics system including the same | Ki Jun SUNG, Jong Hoon Kim, Young Geun Yoo, Pil Soon BAE | 2017-12-05 |
| 9659910 | Manufacturing methods semiconductor packages including through mold connectors | Jong Hoon Kim, Ki Jun SUNG, Young Geun Yoo | 2017-05-23 |
| 9368481 | Semiconductor devices and packages having through electrodes | — | 2016-06-14 |
| 9312232 | Conductive bump, semiconductor chip and stacked semiconductor package using the same | — | 2016-04-12 |
| 9252139 | Stacked semiconductor package and method for manufacturing the same | — | 2016-02-02 |
| 9059150 | Conductive bump, semiconductor chip and stacked semiconductor package using the same | — | 2015-06-16 |
| 8912659 | Stacked semiconductor package and method for manufacturing the same | — | 2014-12-16 |
| 8338921 | Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same | Chang Jun Park, Kwon Whan Han, Seong Cheol Kim, Sung Min Kim, Ha Na Lee +2 more | 2012-12-25 |
| 7859102 | Multi-layer stacked wafer level semiconductor package module | Sung Min Kim, Chang Jun Park, Kwon Whan Han, Seong Cheol Kim, Ha Na Lee | 2010-12-28 |
| 7795073 | Method for manufacturing stack package using through-electrodes | Kwon Whan Han, Chang Jun Park, Seong Cheol Kim, Sung Min Kim, Ha Na Lee | 2010-09-14 |
| 7428121 | Method of locking tape cassette housing of tape recorder | Bong-joo Kim, Jae-kab Seo | 2008-09-23 |
| 7377461 | Tape-end sensor and a magnetic recording and reproducing apparatus having the same | Byeng-Bae Park, Jae-Hoon Sim | 2008-05-27 |
| 7312948 | Cassette tape ejecting apparatus, and magnetic recording/reproducing apparatus having the same | Byeng-Bae Park, Jun Young Kim, Jeong-hyeob Oh, Jae-Hoon Sim, Seung Woo Lee | 2007-12-25 |
| 7282833 | Stator assembly of drum motor, and head drum assembly of magnetic recording/reproducing apparatus | Myoung-Joon Kim, Chung-hum Baik, Byeng-Bae Park, Jae-Hoon Sim, Seung Woo Lee +1 more | 2007-10-16 |
| 7273190 | Magnetic recording and reproducing apparatus and method for braking a reel assembly | Jeong-hyeob Oh, Bong-joo Kim, Jae-Hoon Sim, Byeng-Bae Park, Seung Woo Lee | 2007-09-25 |
| 7270290 | Magnetic recording and reproducing apparatus and driving method thereof | Jun Young Kim, Byeng-Bae Park, Jeong-hyeob Oh, Seung Woo Lee, Jae-Hoon Sim | 2007-09-18 |
| 7215505 | Pole base assembly for magnetic recording/reproducing apparatus | Jae-Hoon Sim, Byeong-bae Park | 2007-05-08 |