Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721680 | Semiconductor package having a three-dimensional stack structure | Jong Hoon Kim | 2023-08-08 |
| 10361141 | Semiconductor packages relating to thermal transfer plate and methods of manufacturing the same | Jong Hoon Kim, Jin-Woo Park | 2019-07-23 |
| 9941253 | Semiconductor packages including interconnectors and methods of fabricating the same | Jin-Woo Park, Joo Wan Hong | 2018-04-10 |
| 9847322 | Semiconductor packages including through mold ball connectors and methods of manufacturing the same | Ki Jun SUNG, Jong Hoon Kim, Hyeong-Seok Choi | 2017-12-19 |
| 8900995 | Semiconductor device and manufacturing method thereof | Won Chul Do, Yong Jae Ko | 2014-12-02 |
| 8487445 | Semiconductor device having through electrodes protruding from dielectric layer | Won Chul Do, Yong Jae Ko | 2013-07-16 |