Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255183 | Semiconductor package including heat dissipation layer | — | 2025-03-18 |
| 11699684 | Semiconductor package including heat dissipation layer | — | 2023-07-11 |
| 9941253 | Semiconductor packages including interconnectors and methods of fabricating the same | Yeon Seung Jung, Jin-Woo Park | 2018-04-10 |