Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804474 | Stack packages and methods of manufacturing the same | Chae Sung LEE | 2023-10-31 |
| 11495545 | Semiconductor package including a bridge die | Jong Hoon Kim, Ki Bum Kim | 2022-11-08 |
| 11444063 | Semiconductor package including vertical interconnector | Chae Sung LEE | 2022-09-13 |
| 11322446 | System-in-packages including a bridge die | Jong Hoon Kim, Ki Bum Kim | 2022-05-03 |
| 11127296 | Apparatus and method for inducing safe driving of a surrounding vehicle | — | 2021-09-21 |
| 10985106 | Stack packages including bridge dies | Ha Gyeong Song | 2021-04-20 |
| 10971452 | Semiconductor package including electromagnetic interference shielding layer | — | 2021-04-06 |
| 10903196 | Semiconductor packages including bridge die | Sang Hyuk LIM | 2021-01-26 |
| 10903131 | Semiconductor packages including bridge die spaced apart from semiconductor die | Sungkyu Kim | 2021-01-26 |
| 10811359 | Stack packages relating to bridge die | Kyoung Tae EUN | 2020-10-20 |
| 10658332 | Stack packages including bridge dies | Jong Hoon Kim | 2020-05-19 |
| 10643973 | Semiconductor packages including a multi-chip stack | — | 2020-05-05 |
| 10553567 | Chip stack packages | Ki Bum Kim | 2020-02-04 |
| 10170456 | Semiconductor packages including heat transferring blocks and methods of manufacturing the same | Rae Hyung JEONG | 2019-01-01 |
| 9922965 | Manufacturing methods semiconductor packages including through mold connectors | Jong Hoon Kim, Young Geun Yoo, Hyeong-Seok Choi | 2018-03-20 |
| 9847322 | Semiconductor packages including through mold ball connectors and methods of manufacturing the same | Jong Hoon Kim, Yeon Seung Jung, Hyeong-Seok Choi | 2017-12-19 |
| 9847285 | Semiconductor packages including heat spreaders and methods of manufacturing the same | Jong Hoon Kim, Han Jun Bae | 2017-12-19 |
| 9837360 | Wafer level packages and electronics system including the same | Hyeong-Seok Choi, Jong Hoon Kim, Young Geun Yoo, Pil Soon BAE | 2017-12-05 |
| 9806015 | Semiconductor packages including through mold ball connectors on elevated pads and methods of manufacturing the same | Jong Hoon Kim, Han Jun Bae | 2017-10-31 |
| 9659910 | Manufacturing methods semiconductor packages including through mold connectors | Jong Hoon Kim, Young Geun Yoo, Hyeong-Seok Choi | 2017-05-23 |
| 9640473 | Semiconductor packages | Young Geun Yoo | 2017-05-02 |
| 9460990 | Substrates and semiconductor packages including the same, electronic systems including the semiconductor packages, and memory cards including the semiconductor packages | — | 2016-10-04 |
| 9324688 | Embedded packages having a connection joint group | Seung Jee KIM, Jong Hyun Nam, Sang Yong Lee, Young Geun Yoo | 2016-04-26 |
| 9170333 | Dynamic range three-dimensional image system | Bongki Mheen, Jae-Sik Sim, Kisoo Kim, MyoungSook Oh, Yong-Hwan Kwon +1 more | 2015-10-27 |
| 9153557 | Chip stack embedded packages | Seung Jee KIM, Jong Hyun Nam, Sang Yong Lee, Young Geun Yoo | 2015-10-06 |