Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430763 | Semiconductor packages including stack modules comprised of interposing bridges and semiconductor dies | Bok Kyu CHOI | 2022-08-30 |
| 10811359 | Stack packages relating to bridge die | Ki Jun SUNG | 2020-10-20 |