Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243853 | Stack package including core die stacked over a controller die | — | 2025-03-04 |
| 11901345 | Semiconductor package | Jeong Hyun PARK | 2024-02-13 |
| 11798917 | Stack package including core die stacked over a controller die | — | 2023-10-24 |
| 11764144 | Storage system including a decoupling device having a plurality of unit capacitors | — | 2023-09-19 |
| 11637089 | Semiconductor package including stacked semiconductor chips | — | 2023-04-25 |
| 11600600 | Semiconductor package including stacked semiconductor chips | — | 2023-03-07 |
| 11515254 | Semiconductor chip including penetrating electrodes, and semiconductor package including the semiconductor chip | Ki Bum Kim | 2022-11-29 |
| 11430763 | Semiconductor packages including stack modules comprised of interposing bridges and semiconductor dies | Kyoung Tae EUN | 2022-08-30 |
| 11342315 | Stack packages including through mold via structures | Juil Eom, Jae-Hoon Lee, Jin-Woo Park | 2022-05-24 |
| 11264319 | Storage system including a decoupling device having a plurality of unit capacitors | — | 2022-03-01 |
| 11222872 | Semiconductor package including stacked semiconductor chips | Chae Sung LEE | 2022-01-11 |
| 11217564 | Stack packages with interposer bridge | — | 2022-01-04 |
| 11205638 | Stack packages including an interconnection structure | — | 2021-12-21 |
| 11201140 | Semiconductor packages including stacked sub-packages with interposing bridges | — | 2021-12-14 |
| 11127687 | Semiconductor packages including modules stacked with interposing bridges | — | 2021-09-21 |
| 11127722 | Stack packages including vertically stacked sub-packages with interposer bridges | — | 2021-09-21 |
| 11114362 | Stacked semiconductor package having heat dissipation structure | Jong Hoon Kim, Ki Bum Kim | 2021-09-07 |
| 11018094 | Semiconductor packages configured for measuring contact resistances and methods of obtaining contact resistances of the semiconductor packages | Ki-Yong Lee, Se Jin Park, Hyoung Min IM | 2021-05-25 |
| 10991640 | Semiconductor packages including bridge die | Jong Hoon Kim, Ki Bum Kim | 2021-04-27 |
| 10957627 | Semiconductor packages including a bridge die | — | 2021-03-23 |
| 10923434 | Semiconductor packages having EMI shielding layers | Juil Eom, Sang Joon LIM | 2021-02-16 |
| 10665570 | Stack packages including through mold vias | Juil Eom, Jae-Hoon Lee | 2020-05-26 |
| 10270102 | Electrode for electrochemical device with low resistance, method for manufacturing the same, and electrochemical device comprising the electrode | Sang Kyun Lee, Byoung-Bae Lee, Ki Young Kwon, Sei Woon Oh | 2019-04-23 |
| 9705154 | Method for prelithiation, method for fabricating lithium secondary battery comprising the method, and lithium secondary battery fabricated from the fabricating method | Sang Kyun Lee, Byoung-Bae Lee, Bong Hyun Jeong, Kyoung Ho Kim, Jang-Bae Kim | 2017-07-11 |
| 9231286 | Package substrate with band stop filter and semiconductor package including the same | Byung Jun Bang, Sang Joon LIM, Ju-il Eom, Jin Hwan SONG | 2016-01-05 |