Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923434 | Semiconductor packages having EMI shielding layers | Bok Kyu CHOI, Juil Eom | 2021-02-16 |
| 10615129 | Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure | Won Duck JUNG, Sung Mook LIM | 2020-04-07 |
| 10157858 | Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure | Won Duck JUNG, Sung Mook LIM | 2018-12-18 |
| 10115708 | Semiconductor package having a redistribution line structure | Ju-il Eom, Jae-Hoon Lee | 2018-10-30 |
| 9609742 | Electrical characteristics of package substrates and semiconductor packages including the same | Eul Chul Jang, Qwan Ho CHUNG, Sung Woo Han | 2017-03-28 |
| 9231286 | Package substrate with band stop filter and semiconductor package including the same | Byung Jun Bang, Ju-il Eom, Bok Kyu CHOI, Jin Hwan SONG | 2016-01-05 |
| 8441116 | Semiconductor package having substrate for high speed semiconductor package | Woong Sun LEE, Qwan Ho CHUNG, Il Hwan Cho, Jong Woo Yoo, Jin Ho Bae +1 more | 2013-05-14 |
| 8338921 | Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same | Chang Jun Park, Kwon Whan Han, Seong Cheol Kim, Sung Min Kim, Hyeong-Seok Choi +2 more | 2012-12-25 |
| 8084839 | Circuit board having conductive shield member and semiconductor package using the same | Bok Kyu CHOI, Eul Chul Jang | 2011-12-27 |
| 7808072 | Circuit board having conductive shield member and semiconductor package using the same | Bok Kyu CHOI, Eul Chul Jang | 2010-10-05 |