Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131997 | Semiconductor packages | — | 2024-10-29 |
| 11233033 | Semiconductor packages including chips stacked on a base module | — | 2022-01-25 |
| 10741529 | Semiconductor packages | Sung Ho Hyun, Ju-il Eom | 2020-08-11 |
| 10629543 | Package substrates having an electromagnetic bandgap structure and semiconductor packages employing the package substrates | Sung Mook LIM, Hye Won Kim | 2020-04-21 |
| 10615129 | Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure | Sang Joon LIM, Sung Mook LIM | 2020-04-07 |
| 10224314 | Semiconductor packages | Sung Ho Hyun, Ju-il Eom | 2019-03-05 |
| 10157858 | Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure | Sang Joon LIM, Sung Mook LIM | 2018-12-18 |
| 9668344 | Semiconductor packages having interconnection members | Jong Ho Lee, Joo Hyun Kang, Chong Ho Cho, In-chul Hwang | 2017-05-30 |
| 9543384 | Semiconductor package | Han Jun Bae | 2017-01-10 |
| 9345136 | Package substrates, semiconductor packages including the same, electronic systems including the same, and memory cards including the same | Seung Jee KIM | 2016-05-17 |