Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741529 | Semiconductor packages | Won Duck JUNG, Ju-il Eom | 2020-08-11 |
| 10224314 | Semiconductor packages | Won Duck JUNG, Ju-il Eom | 2019-03-05 |
| 8829689 | Module substrate with feature for replacement of faulty chips, semiconductor module having the same, and method for manufacturing the semiconductor module | Ki Young Kim, Myung Gun PARK, Jin Ho Bae | 2014-09-09 |
| 8823183 | Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor package | Ki Young Kim, Qwan Ho CHUNG, Myung Gun PARK, Jin Ho Bae | 2014-09-02 |
| 8399998 | Semiconductor package requiring reduced manufacturing processes | Ki Young Kim, Myung Geun Park, Woong Sun LEE | 2013-03-19 |
| 7800201 | Thinned wafer having stress dispersion parts and method for manufacturing semiconductor package using the same | — | 2010-09-21 |