Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9209133 | Semiconductor apparatus | Jae Min Kim | 2015-12-08 |
| 8829689 | Module substrate with feature for replacement of faulty chips, semiconductor module having the same, and method for manufacturing the semiconductor module | Ki Young Kim, Sung Ho Hyun, Jin Ho Bae | 2014-09-09 |
| 8823183 | Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor package | Ki Young Kim, Qwan Ho CHUNG, Sung Ho Hyun, Jin Ho Bae | 2014-09-02 |
| 8716854 | Multi-chip package | Ki Young Kim | 2014-05-06 |