Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11773417 | Microalgal strains of Thraustochytrium genus, and method of producing polyunsaturated fatty acids using the same | Ji-Young Kim, Hye Min Park, Jung Woon Choi, Sang Min Park, Sang Young Bae +1 more | 2023-10-03 |
| 9786590 | Semiconductor package including a conductive fabric | In-chul Hwang, Ki Young Kim | 2017-10-10 |
| 8680652 | Stack package | Si-Han Kim | 2014-03-25 |
| 8581397 | Substrate for semiconductor package with improved bumping of chip bumps and contact pads and semiconductor package having the same | — | 2013-11-12 |
| 8399998 | Semiconductor package requiring reduced manufacturing processes | Ki Young Kim, Sung Ho Hyun, Woong Sun LEE | 2013-03-19 |
| 8183689 | Printed circuit board and flip chip package using the same with improved bump joint reliability | Seong Cheol Kim | 2012-05-22 |
| 7859108 | Flip chip package and method for manufacturing the same | Woong Sun LEE, Il Hwan Cho, Cheol Ho JOH, Eun Hye DO, Ki Young Kim +2 more | 2010-12-28 |
| 7595255 | Method for manufacturing strip level substrate without warpage and method for manufacturing semiconductor package using the same | Seong Cheol Kim | 2009-09-29 |
| 7417308 | Stack type package module and method for manufacturing the same | — | 2008-08-26 |
| 6677181 | Method for fabricating stacked chip package device | Chang Jun Park, Nam Soo Lee, Hyung Gil Baik, Yoon-hwa Choi | 2004-01-13 |
| 6316825 | Chip stack package utilizing a connecting hole to improve electrical connection between leadframes | Chang Jun Park, Nam Soo Lee, Hyung Gil Baik, Yoon-hwa Choi | 2001-11-13 |
| 5577039 | System and method of signal transmission within a plesiochronous digital hierarchy unit using ATM adaptation layers | Chan Youn WON, Young-II Kim, Gyu Seon Lee | 1996-11-19 |