Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12239806 | Peritoneal cavity-bladder connecting catheter for ascites drainage | Il Hwan Kim, Myeong Ju Kang, Bong Su Park, Si Hyung Park, Yu Jin Lee +5 more | 2025-03-04 |
| 12096237 | Method for predicting structure of indoor space using radio propagation channel analysis through deep learning | Jung Yong Lee | 2024-09-17 |
| 11892558 | Method and apparatus for estimating direction of arrival of radar reception signal using antenna array extrapolation | Seong-Wook Lee, Heon-Kyo Sim | 2024-02-06 |
| 11771159 | Modularized garment manufacturing method for small quantity batch production of garments and modularized garment manufacturing system | Young-Chul Park, Sung Hoon Ahn, Eun Suk Suh, Sung Min Kim, Woo Kyun Jung | 2023-10-03 |
| 11636717 | Allophone inspection device and inspection method thereof | Sung Wook Lee, Joo Hyun Park, Byeong Ho Lee, Wanjei Cho | 2023-04-25 |
| 10784706 | Wireless power transmitter and method for controlling the same | Chong-Min Lee, Dae Hyun Kim, Sang Wook Lee, Young Ho Ryu, Byeong Ho Lee +2 more | 2020-09-22 |
| 10749132 | Electrode laminate and organic light emitting device element | Jin Ha Hwang, Seongsu Jang, Young Eun Kim, Sung Soo Park, Kwang Myung Seo | 2020-08-18 |
| 10381590 | Electrode laminate and organic light emitting device element | Jin Ha Hwang, Seongsu Jang, Young Eun Kim, Sung Soo Park, Kwang Myung Seo | 2019-08-13 |
| 9577948 | Method and apparatus for connecting to server using trusted IP address of domain | Byoung Hoon Kim | 2017-02-21 |
| 9269670 | Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package | — | 2016-02-23 |
| 9137691 | Method and apparatus for estimating long-term transfer rate of terminal | Jeong-sik Choi | 2015-09-15 |
| 9029602 | Anti-microbial and anti-static surface treatment agent with quaternary ammonium salt as active ingredient and method for preventing static electricity in polymer fibers using same | — | 2015-05-12 |
| 8823161 | Semiconductor chip, semiconductor package, and method for manufacturing semiconductor chip for reducing open failures | — | 2014-09-02 |
| 8803325 | Stacked semiconductor package | — | 2014-08-12 |
| 8766457 | Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package | — | 2014-07-01 |
| 8681133 | Display driver integrated circuit which stores output mode of driving circuit control signal in non-volatile memory and method of outputting the driving circuit control signal | Jong Kon Bae, Won-Sik Kang | 2014-03-25 |
| 8592952 | Semiconductor chip and semiconductor package with stack chip structure | Seung Hee JO | 2013-11-26 |
| 8478292 | Wireless localization method based on an efficient multilateration algorithm over a wireless sensor network and a recording medium in which a program for the method is recorded | Jung Kyu Lee | 2013-07-02 |
| 8399984 | Semiconductor package | — | 2013-03-19 |
| 8395245 | Semiconductor package module | Jong Hoon Kim, Min Suk Suh, Seung Taek YANG, Seung Hyun Lee | 2013-03-12 |
| 8338921 | Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same | Chang Jun Park, Kwon Whan Han, Sung Min Kim, Hyeong-Seok Choi, Ha Na Lee +2 more | 2012-12-25 |
| 8237291 | Stack package | — | 2012-08-07 |
| 8232642 | Printed circuit board | Chang Jun Park | 2012-07-31 |
| 8198719 | Semiconductor chip and semiconductor package including the same | — | 2012-06-12 |
| 8183689 | Printed circuit board and flip chip package using the same with improved bump joint reliability | Myung Geun Park | 2012-05-22 |