Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8042020 | Data error correction circuit, integrated circuit for data error correction, and method of performing data error correction | Won-Sik Kang | 2011-10-18 |
| 7898834 | Semiconductor chip with chip selection structure and stacked semiconductor package having the same | Sung Min Kim, Chang Jun Park, Kwon Whan Han, Ha Na Lee | 2011-03-01 |
| 7859102 | Multi-layer stacked wafer level semiconductor package module | Sung Min Kim, Chang Jun Park, Kwon Whan Han, Hyeong-Seok Choi, Ha Na Lee | 2010-12-28 |
| 7795073 | Method for manufacturing stack package using through-electrodes | Kwon Whan Han, Chang Jun Park, Sung Min Kim, Hyeong-Seok Choi, Ha Na Lee | 2010-09-14 |
| 7795139 | Method for manufacturing semiconductor package | Kwon Whan Han, Chang Jun Park, Min Suk Suh, Sung Min Kim, Seung Taek YANG +3 more | 2010-09-14 |
| 7710377 | LCD panel including gate drivers | Won-Sik Kang, Sung Jin Jang, Jae-Hyuck Woo, Chul-Joon Choi, Kyu-young Chung | 2010-05-04 |
| 7595255 | Method for manufacturing strip level substrate without warpage and method for manufacturing semiconductor package using the same | Myung Geun Park | 2009-09-29 |
| 7446405 | Wafer level chip scale package (WLCSP) with high reliability against thermal stress | Jong Hoon Kim, Min Suk Suh, Chang Jun Park, Kwon Whan Han | 2008-11-04 |
| 7355286 | Flip chip bonded package applicable to fine pitch technology | — | 2008-04-08 |
| 7333549 | Method and apparatus for estimating a signal sequence in a MIMO-OFDM mobile communication system | Jong Ho Lee, Jae-Hak Chung, Chan-Soo Hwang, Seung-Hoon Nam, Do-Young Kwak +1 more | 2008-02-19 |
| 7005791 | Flat panel for cathode-ray tube | Kyoung Mun Choo, Eon Jin Jeong | 2006-02-28 |
| 5888056 | Diaphragm pump | — | 1999-03-30 |