Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8847377 | Stacked wafer level package having a reduced size | Jong Hoon Kim, Seung Taek YANG, Seung Hyun Lee, Tae-Min Kang | 2014-09-30 |
| 8698283 | Substrate for semiconductor package and semiconductor package having the same | — | 2014-04-15 |
| 8524530 | Flexible semiconductor package and method for fabricating the same | — | 2013-09-03 |
| 8395245 | Semiconductor package module | Jong Hoon Kim, Seong Cheol Kim, Seung Taek YANG, Seung Hyun Lee | 2013-03-12 |
| 8361838 | Semiconductor package and method for manufacturing the same via holes in semiconductor chip for plurality stack chips | Seung Taek YANG, Seung Hyun Lee, Jong Hoon Kim | 2013-01-29 |
| 8358016 | Semiconductor package having an internal cooling system | Chang Jun Park | 2013-01-22 |
| 8319327 | Semiconductor package with stacked chips and method for manufacturing the same | — | 2012-11-27 |
| 8299582 | Substrate for semiconductor package and semiconductor package having the same | — | 2012-10-30 |
| 8299592 | Cube semiconductor package composed of a plurality of stacked together and interconnected semiconductor chip modules | Seung Hyun Lee | 2012-10-30 |
| 8232654 | Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same | — | 2012-07-31 |
| 8203217 | Semiconductor package having a stacked wafer level package and method for fabricating the same | — | 2012-06-19 |
| 8202762 | Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the same | Sung Min Kim | 2012-06-19 |
| 8159065 | Semiconductor package having an internal cooling system | Chang Jun Park | 2012-04-17 |
| 8097933 | Flexible semiconductor package and method for fabricating the same | — | 2012-01-17 |
| 8049341 | Semiconductor package and method for manufacturing the same | Seung Taek YANG, Seung Hyun Lee, Jong Hoon Kim | 2011-11-01 |
| 8018043 | Semiconductor package having side walls and method for manufacturing the same | Seung Taek YANG, Seung Hyun Lee, Jong Hoon Kim | 2011-09-13 |
| 7973414 | Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same | — | 2011-07-05 |
| 7923294 | Semiconductor package and method for manufacturing the same for decreasing number of processes | — | 2011-04-12 |
| 7911065 | Semiconductor package having a stacked wafer level package and method for fabricating the same | — | 2011-03-22 |
| 7871925 | Stack package and method for manufacturing the same | Sung Min Kim | 2011-01-18 |
| 7859115 | Semiconductor package for improving characteristics for transmitting signals and power | Jong Hoon Kim, Seung Taek YANG | 2010-12-28 |
| 7834463 | Stack package having pattern die redistribution | Sung Min Kim, Kwon Whan Han | 2010-11-16 |
| 7795139 | Method for manufacturing semiconductor package | Kwon Whan Han, Chang Jun Park, Seong Cheol Kim, Sung Min Kim, Seung Taek YANG +3 more | 2010-09-14 |
| 7732931 | Semiconductor package and method for manufacturing the same for decreasing number of processes | — | 2010-06-08 |
| 7598617 | Stack package utilizing through vias and re-distribution lines | Seung Hyun Lee | 2009-10-06 |