Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8609535 | Semiconductor package having through electrodes that reduce leakage current and method for manufacturing the same | Sung-Cheol Kim, Sung Min Kim | 2013-12-17 |
| 8592952 | Semiconductor chip and semiconductor package with stack chip structure | Seong Cheol Kim | 2013-11-26 |