Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490187 | Semiconductor package on which semiconductor chip is mounted on substrate with window | — | 2016-11-08 |
| 9305912 | Stack package and method for manufacturing the same | Hee Min SHIN, Eun Hye DO, Ji Eun Kim, Kyu Won Lee | 2016-04-05 |
| 9165899 | Stacked package and method for manufacturing the same | — | 2015-10-20 |
| 9093441 | Semiconductor packages including semiconductor chips having protrusions and methods of fabricating the same | Ji Eun Kim, Hee Min SHIN, Kyu Won Lee, Chong Ho Cho | 2015-07-28 |
| 9082634 | Stack package and method for manufacturing the same | Hee Min SHIN, Eun Hye DO, Ji Eun Kim, Kyu Won Lee | 2015-07-14 |
| 8951810 | Methods for forming interconnection line using screen printing technique | Kyu Won Lee, Ji Eun Kim, Hee Min SHIN, Chong Ho Cho | 2015-02-10 |
| 8822271 | Method and apparatus for manufacturing chip package | — | 2014-09-02 |
| 8564141 | Chip unit and stack package having the same | Kyu Won Lee, Eun Hye DO, Ji Eun Kim, Hee Min SHIN | 2013-10-22 |
| 8476751 | Stacked semiconductor package and method for manufacturing the same | Kyu Won Lee, Eun Hye DO, Ji Eun Kim, Hee Min SHIN | 2013-07-02 |
| 7859108 | Flip chip package and method for manufacturing the same | Woong Sun LEE, Il Hwan Cho, Myung Geun Park, Eun Hye DO, Ki Young Kim +2 more | 2010-12-28 |
| 7705468 | Stacked semiconductor package that prevents damage to semiconductor chip when wire-bonding and method for manufacturing the same | — | 2010-04-27 |