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Map compression method for indoor positioning |
Lynn Choi |
2025-08-26 |
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Device and method for mediating heavy equipment and system using the same |
Seok Ho Bae, Hyun Bae |
2022-11-15 |
| 11309303 |
Semiconductor package including stacked semiconductor chips |
Ju-il Eom, Seung Yeop Lee |
2022-04-19 |
| 11270958 |
Semiconductor package including capacitor |
Ju-il Eom, Jin Kyoung Park |
2022-03-08 |
| 9972568 |
Stretchable semiconductor packages and semiconductor devices including the same |
Jong Hoon Kim, Chan Woo Jeong |
2018-05-15 |
| 9888567 |
Flexible device including sliding interconnection structure |
Seung Yeop Lee, Joo Hyun Kang, Jong Hoon Kim |
2018-02-06 |
| 9847285 |
Semiconductor packages including heat spreaders and methods of manufacturing the same |
Ki Jun SUNG, Jong Hoon Kim |
2017-12-19 |
| 9806016 |
Stretchable semiconductor packages and semiconductor devices including the same |
Jong Hoon Kim, Chan Woo Jeong |
2017-10-31 |
| 9806015 |
Semiconductor packages including through mold ball connectors on elevated pads and methods of manufacturing the same |
Ki Jun SUNG, Jong Hoon Kim |
2017-10-31 |
| 9659833 |
Semiconductor packages, methods of manufacturing the same, electronic systems including the same, and memory cards including the same |
Dae Woong Lee, Tae-Min Kang |
2017-05-23 |
| 9543384 |
Semiconductor package |
Won Duck JUNG |
2017-01-10 |
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Stack packages and methods of fabricating the same |
Jong Hoon Kim |
2016-06-14 |
| 9343439 |
Stack packages and methods of manufacturing the same |
Jin Ho Bae |
2016-05-17 |
| 9214410 |
Stack packages and methods of fabricating the same |
Jong Hoon Kim |
2015-12-15 |
| 9196607 |
Stack packages and methods of manufacturing the same |
Jin Ho Bae |
2015-11-24 |
| 8618637 |
Semiconductor package using through-electrodes having voids |
Woong Sun LEE |
2013-12-31 |
| 8072046 |
Through-electrode, circuit board having a through-electrode, semiconductor package having a through-electrode, and stacked semiconductor package having the semiconductor chip or package having a through-electrode |
Jong Hoon Kim |
2011-12-06 |
| 7759807 |
Semiconductor package having structure for warpage prevention |
Jae Myun Kim |
2010-07-20 |