Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9064862 | Semiconductor chips having a dual-layered structure, packages having the same, and methods of fabricating the semiconductor chips and the packages | In-chul Hwang, Seung Jee KIM, Jin Su Lee | 2015-06-23 |
| 8492889 | Semiconductor package | Seung Jee KIM, Ki Bum Kim | 2013-07-23 |
| 8390114 | Semiconductor package | Seung Jee KIM, Ki Bum Kim | 2013-03-05 |
| 8304879 | Spiral staircase shaped stacked semiconductor package and method for manufacturing the same | Da Un NAH, Tae Hoon Kim, Jung Tae JEONG, Bok Gyu MIN, Ki Bum Kim | 2012-11-06 |
| 8242582 | Semiconductor package and stacked semiconductor package having the same | Bok Gyu MIN, Da Un NAH | 2012-08-14 |
| 7989943 | Staircase shaped stacked semiconductor package | Seung Jee KIM, Kyoung-mo Yang | 2011-08-02 |
| 7825504 | Semiconductor package and multi-chip semiconductor package using the same | — | 2010-11-02 |
| 7759807 | Semiconductor package having structure for warpage prevention | Han Jun Bae | 2010-07-20 |
| 6380615 | Chip size stack package, memory module having the same, and method of fabricating the module | Sang Wook Park | 2002-04-30 |
| 6380629 | Wafer level stack package and method of fabricating the same | — | 2002-04-30 |
| 6121682 | Multi-chip package | — | 2000-09-19 |