Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033952 | Semiconductor packages including at least one die position checker | Suk Won Lee | 2024-07-09 |
| 11769700 | Semiconductor substrate, semiconductor package including semiconductor substrate, and test method of semiconductor substrate | — | 2023-09-26 |
| 11764160 | Semiconductor packages including at least one die position checker | Suk Won Lee | 2023-09-19 |
| 11239177 | Semiconductor packages including die over-shift indicating patterns | Sukwon Lee | 2022-02-01 |
| 10692816 | Semiconductor packages including die over-shift indicating patterns | Sukwon Lee | 2020-06-23 |
| 10312196 | Semiconductor packages including indicators for evaluating a distance and methods of calculating the distance | Sukwon Lee | 2019-06-04 |
| 9412716 | Semiconductor package and method for manufacturing the same | Jin Ho Bae, Qwan Ho CHUNG, Seong Kweon Ha, Jong Hyun Kim, Jae Won Shin | 2016-08-09 |
| 8907490 | Semiconductor packages having the first and second chip inclined sidewalls contact with each other | So Hyun Jung | 2014-12-09 |
| 8624375 | Semiconductor package for selecting semiconductor chip from a chip stack | Joon Ki Hong, Tae Hoon Kim, Da Un NAH, Jae Joon Ahn, Ki Bum Kim | 2014-01-07 |
| 8525319 | Selecting chips within a stacked semiconductor package using through-electrodes | Kyoung Sook Park, Da Un NAH | 2013-09-03 |
| 8304879 | Spiral staircase shaped stacked semiconductor package and method for manufacturing the same | Da Un NAH, Jae Myun Kim, Tae Hoon Kim, Jung Tae JEONG, Ki Bum Kim | 2012-11-06 |
| 8242582 | Semiconductor package and stacked semiconductor package having the same | Jae Myun Kim, Da Un NAH | 2012-08-14 |