Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11557523 | Semiconductor packages and methods of forming the semiconductor packages | Jae-Woong Yu | 2023-01-17 |
| 10950512 | Semiconductor packages including a semiconductor chip and methods of forming the semiconductor packages | Jae-Woong Yu | 2021-03-16 |
| 10879160 | Semiconductor package with packaging substrate | Jae-Woong Yu | 2020-12-29 |
| 9536861 | Semiconductor package including a plurality of stacked chips | Jae-Woong Yu, Jong Seo Jung, Seong Cheol Shin | 2017-01-03 |
| 8907490 | Semiconductor packages having the first and second chip inclined sidewalls contact with each other | Bok Gyu MIN | 2014-12-09 |