Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848301 | Method of manufacturing a semiconductor package | Jonggu LEE, Sunghyup Kim, Byungjo KIM, Sanghoon Lee, Sebin Choi | 2023-12-19 |
| 11626381 | Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the same | Jonggu LEE, Sunghyup Kim, Byungjo KIM, Sanghoon Lee, Sebin Choi | 2023-04-11 |
| 11607741 | Semiconductor chip bonding apparatus including head having thermally conductive materials | Sebin Choi, Sunghyup Kim, Jonggu LEE | 2023-03-21 |
| 11239177 | Semiconductor packages including die over-shift indicating patterns | Bok Gyu MIN | 2022-02-01 |
| 10692816 | Semiconductor packages including die over-shift indicating patterns | Bok Gyu MIN | 2020-06-23 |
| 10312196 | Semiconductor packages including indicators for evaluating a distance and methods of calculating the distance | Bok Gyu MIN | 2019-06-04 |
| 9553069 | Bonding apparatus and substrate manufacturing equipment including the same | Ilyoung Han, Kyoungran Kim, Donggil Shim, Geunsik Oh, Youngjoo Lee +1 more | 2017-01-24 |
| 8835503 | Pharmaceutical composition containing GLUR2-lacking AMPAR antagonist for preventing or treating psychiatric illnesses | Sukwoo Choi, Jeongyeon Kim, Beomjong Song, Ingie Hong, Sungmo Park +5 more | 2014-09-16 |