Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12298676 | Substrate processing apparatus | Injae Lee, Sungyong Bae, Daegeun YOON, Inho Choi, Sunghyup Kim +6 more | 2025-05-13 |
| 11848301 | Method of manufacturing a semiconductor package | Sunghyup Kim, Byungjo KIM, Sanghoon Lee, Sukwon Lee, Sebin Choi | 2023-12-19 |
| 11626381 | Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the same | Sunghyup Kim, Byungjo KIM, Sanghoon Lee, Sukwon Lee, Sebin Choi | 2023-04-11 |
| 11607741 | Semiconductor chip bonding apparatus including head having thermally conductive materials | Sebin Choi, Sunghyup Kim, Sukwon Lee | 2023-03-21 |
| 10448323 | Node unit of distributed antenna system | Hyoungho Kim, Kwon Kim, Heegon Kim | 2019-10-15 |