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Substrate processing apparatus |
Injae Lee, Sungyong Bae, Daegeun YOON, Inho Choi, Sunghyup Kim +6 more |
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| 11848301 |
Method of manufacturing a semiconductor package |
Sunghyup Kim, Byungjo KIM, Sanghoon Lee, Sukwon Lee, Sebin Choi |
2023-12-19 |
| 11626381 |
Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the same |
Sunghyup Kim, Byungjo KIM, Sanghoon Lee, Sukwon Lee, Sebin Choi |
2023-04-11 |
| 11607741 |
Semiconductor chip bonding apparatus including head having thermally conductive materials |
Sebin Choi, Sunghyup Kim, Sukwon Lee |
2023-03-21 |
| 10448323 |
Node unit of distributed antenna system |
Hyoungho Kim, Kwon Kim, Heegon Kim |
2019-10-15 |
