Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322681 | Semiconductor chip including through electrode, and semiconductor package including the same | Seung Hwan Kim, Hyun Chul SEO, Hyeong-Seok Choi | 2025-06-03 |
| 11764128 | Semiconductor chip including through electrode, and semiconductor package including the same | Seung Hwan Kim, Hyun Chul SEO, Hyeong-Seok Choi | 2023-09-19 |
| 9070691 | Semiconductor package and stacked semiconductor package having the same | Jae Sung Oh, Jong Hyun Kim, Jin Ho Gwon | 2015-06-30 |
| 8823158 | Semiconductor package and stacked semiconductor package having the same | Jae Sung Oh, Jong Hyun Kim, Jin Ho Gwon, Dong You Kim, Ki Bon Cha | 2014-09-02 |
| 8299591 | Semiconductor package and stacked semiconductor package having the same | Jae Sung Oh, Jong Hyun Kim, Jin Ho Gwon, Dong You Kim, Ki Bon Cha | 2012-10-30 |