Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394487 | Method of programming data in nonvolatile memory device and nonvolatile memory device performing the same | — | 2025-08-19 |
| 12322681 | Semiconductor chip including through electrode, and semiconductor package including the same | Seung Hwan Kim, Hyeong-Seok Choi, Moon Un Hyun | 2025-06-03 |
| 12278193 | Semiconductor devices including recognition marks | — | 2025-04-15 |
| 12230328 | Semiconductor device | — | 2025-02-18 |
| 12142572 | Semiconductor package including stacked semiconductor chips | — | 2024-11-12 |
| 12093349 | Method for distributing certificate of right to use digital content, and computer program stored in medium in order to carry out method | — | 2024-09-17 |
| 11823975 | Semiconductor packages including different type semiconductor chips having exposed top surfaces and methods of manufacturing the semiconductor packages | — | 2023-11-21 |
| 11764128 | Semiconductor chip including through electrode, and semiconductor package including the same | Seung Hwan Kim, Hyeong-Seok Choi, Moon Un Hyun | 2023-09-19 |
| 11682614 | Semiconductor package and package substrate including vent hole | Jun Sik Kim | 2023-06-20 |
| 11417618 | Semiconductor device including redistribution layer and method for fabricating the same | Seung Hwan Kim, Hyeong-Seok Choi, Shin Young Park | 2022-08-16 |
| 11398412 | Semiconductor package | — | 2022-07-26 |
| 11380595 | Semiconductor wafer, method for separating the semiconductor wafer, semiconductor chip, and semiconductor package including the semiconductor chip | — | 2022-07-05 |
| 11217544 | Semiconductor package including a semiconductor chip having a redistribution layer | Jong Hyun Kim, Seung Hwan Kim, Ki Young Kim | 2022-01-04 |
| 11088117 | Semiconductor package including stacked semiconductor chips | Jun Sik Kim | 2021-08-10 |
| 10991598 | Methods of fabricating semiconductor packages including circuit patterns | Hyeong-Seok Choi, Seang Hwan Kim | 2021-04-27 |
| 10460771 | Semiconductor chip module and semiconductor package including the same | Jun Sik Kim | 2019-10-29 |
| 10366727 | Semiconductor chip module and semiconductor package including the same | Jun Sik Kim | 2019-07-30 |
| 9666240 | Semiconductor device with decreased overlapping area between redistribution lines and signal lines | — | 2017-05-30 |
| 8772937 | Semiconductor device including inner interconnection structure able to conduct signals or voltages in the semiconductor chip with vertical connection vias and horizontal buried conductive lines | Seung Yeop Lee | 2014-07-08 |
| 8399994 | Semiconductor chip and semiconductor package having the same | Hee Ra Roh, Il Hwan Cho, Jae Min Kim, Dong Hwan Seol | 2013-03-19 |
| 7065084 | Data structure for implementation of traffic engineering function in multiprotocol label switching system and storage medium for storing the same | — | 2006-06-20 |