Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368134 | Semiconductor packages including dam patterns and methods for manufacturing the same | Dong Hyun Kim | 2025-07-22 |
| 12227477 | Method for preparing single isomer of 1-(1-(2-benzylphenoxy)propan-2-yl)-2-methylpiperidine in high-purity | Kwang Ho Kim, Ji Sang Yoo, Chi Jang Moon, You Na Moon, So Hee Kim | 2025-02-18 |
| 12132110 | Synaptic transistor with long-term and short-term memory | Dae Hwan Kim, Dong Yeon Kang, Jun Tae Jang, Hyun Kyu Lee, Sung-Jin Choi +2 more | 2024-10-29 |
| 11699680 | Semiconductor packages including dam patterns and methods for manufacturing the same | Dong Hyun Kim | 2023-07-11 |
| 11684642 | Composition for the treatment of atopic dermatitis comprising Bifidobacterium animalis subsp. lactis LM1017 | Min Gyu JEON, Yun Yeon Kim | 2023-06-27 |
| 11417618 | Semiconductor device including redistribution layer and method for fabricating the same | Seung Hwan Kim, Hyun Chul SEO, Hyeong-Seok Choi | 2022-08-16 |
| 10998266 | Semiconductor devices including redistributed layer structures and methods of forming semiconductor devices including redistributed layer structures | Ki Jun Bang, Sang Jae Kim | 2021-05-04 |
| 10772207 | Flexible semiconductor package and method for fabricating the same | Kyeong Su Kim, Jae Jin Lee | 2020-09-08 |
| 9504662 | Composition for skin improvement comprising hexamidines and retinoids | Jong Hee Park, Hong-Ju Shin, Do Hoon Kim, Chang-Geun Yi, Won Seok Park +3 more | 2016-11-29 |
| 8530754 | Printed circuit board having adaptable wiring lines and method for manufacturing the same | — | 2013-09-10 |
| 8178975 | Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers | Seung Taek YANG | 2012-05-15 |
| 7847419 | Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers | Seung Taek YANG | 2010-12-07 |