Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8823158 | Semiconductor package and stacked semiconductor package having the same | Jae Sung Oh, Moon Un Hyun, Jong Hyun Kim, Jin Ho Gwon, Ki Bon Cha | 2014-09-02 |
| 8445166 | Fabrication method of lithography mask and formation method of fine pattern using the same | Ho-Young Song, Won Ho Jung, Young Jin Cho, Young Chun Kim | 2013-05-21 |
| 8299591 | Semiconductor package and stacked semiconductor package having the same | Jae Sung Oh, Moon Un Hyun, Jong Hyun Kim, Jin Ho Gwon, Ki Bon Cha | 2012-10-30 |
| 8110751 | Semiconductor memory module and electronic component socket for coupling with the same | Yong Tae Kyeon, Ja Yong Ku | 2012-02-07 |
| 7291906 | Stack package and fabricating method thereof | Ki Bon Cha | 2007-11-06 |
| 6118174 | Bottom lead frame and bottom lead semiconductor package using the same | — | 2000-09-12 |
| 6010058 | BGA package using a dummy ball and a repairing method thereof | Young Gon Kim | 2000-01-04 |
| 5939776 | Lead frame structure having non-removable dam bars for semiconductor package | Teck-Gyu Kang | 1999-08-17 |
| 5926380 | Lead frame lattice and integrated package fabrication method applied thereto | — | 1999-07-20 |
| 5748450 | BGA package using a dummy ball and a repairing method thereof | Young Gon Kim | 1998-05-05 |