Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9980393 | Pattern-forming method for forming a conductive circuit pattern | Yong Sung EOM, Kwang-Seong Choi, Hyun Cheol Bae, Jung Hyun Noh | 2018-05-22 |
| 9462736 | Composition and methods of forming solder bump and flip chip using the same | Yong Sung EOM, Sangwon OH, KeonSoo JANG | 2016-10-04 |
| 9293689 | Method of manufacturing a piezoelectric micro energy harvester | Chi Hoon Jun, Sang Choon Ko | 2016-03-22 |
| 9155236 | Composition and methods of forming solder bump and flip chip using the same | Yong Sung EOM, Sangwon OH, KeonSoo JANG | 2015-10-06 |
| 8802760 | Composition and methods of forming solder bump and flip chip using the same | Yong Sung EOM, Sangwon OH, KeonSoo JANG | 2014-08-12 |
| 8723292 | Silicon interposer including backside inductor | Hyun Cheol Bae, Kwang-Seong Choi, Jong Moon Park | 2014-05-13 |
| 8598768 | Piezoelectric micro energy harvester and manufacturing method thereof | Chi Hoon Jun, Sang Choon Ko | 2013-12-03 |
| 8524571 | Vacuum wafer level packaging method for micro electro mechanical system device | Yong Sung EOM, Hyun Cheol Bae | 2013-09-03 |
| 8420722 | Composition and methods of forming solder bump and flip chip using the same | Yong Sung EOM, Sangwon OH, KeonSoo JANG | 2013-04-16 |
| 8211745 | Method and structure for bonding flip chip | Yong Sung EOM, Kwang-Seong Choi | 2012-07-03 |
| 8044757 | Electronic device including LTCC inductor | Hyun Cheol Bae, Kwang-Seong Choi, Yong Sung EOM, Moo Jung Chu, Jong Hyun Lee | 2011-10-25 |
| 8030200 | Method for fabricating a semiconductor package | Yong Sung EOM, Kwang-Seong Choi, Hyun Cheol Bae, Jong Hyun Lee | 2011-10-04 |
| 7985697 | Wafer level package and method of fabricating the same | Yong Sung EOM, Min Ji Lee, Hyun-Kyu Yu | 2011-07-26 |
| 7733207 | Vertically formed inductor and electronic device having the same | Ho-Gyeong YUN, Kwang-Seong Choi | 2010-06-08 |
| 7553092 | Optical module and optical module package | Kwang-Seong Choi, Yong-Duck CHUNG, Young Shik Kang, Dong Suk Jun, Je Ha Kim | 2009-06-30 |
| 7520682 | Transceiver module and optical bench for passive alignment | Yong Sung EOM, Ho-Gyeong YUN, Byung Seok Choi, Jong Hyun Lee | 2009-04-21 |
| 7298933 | Optical module | Kwang-Seong Choi, Jong Hyun Lee, Yong-Duck CHUNG, Young Shik Kang, Je Ha Kim | 2007-11-20 |
| 7012939 | Wavelength stabilization module having light-receiving element array and method of manufacturing the same | Kwang-Seong Choi, Heung Woo Park, Ho-Gyeong YUN, Byung Seok Choi, Yong Sung EOM +1 more | 2006-03-14 |
| 7009716 | System for monitoring optical output/wavelength | Jong Deog Kim, Byung Seok Choi, Jong Hyun Lee, Hogyeong Yun, Kwang-Seong Choi | 2006-03-07 |
| 6825065 | Method for optical module packaging of flip chip bonding | Yong Sung EOM | 2004-11-30 |
| 6707161 | Optical module package of flip chip bonding | Yong Sung EOM | 2004-03-16 |
| 6297543 | Chip scale package | Sung Hak Hong, Chang Jun Park, Yoon-hwa Choi | 2001-10-02 |
| 5854867 | Optical module having lenses aligned on lens-positioning V-groove and fabrication method thereof | Sang Hwan Lee, Min-Kyu Song, Nam Hwang, Seong Su Park | 1998-12-29 |