Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12349505 | Method of manufacturing electric device | Jiho JOO, Kwang-Seong Choi, Chanmi Lee, Gwang-Mun CHOI, Ki Seok Jang +2 more | 2025-07-01 |
| 12206056 | Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materials | Kwang-Seong Choi, Jiho JOO, Gwang-Mun CHOI, Seok-Hwan MOON, Chanmi Lee +1 more | 2025-01-21 |
| 11677060 | Method for transferring and bonding of devices | Jiho JOO, Gwang-Mun CHOI, Kwang-Seong Choi, Chanmi Lee, Ki Seok Jang | 2023-06-13 |
| 11618109 | Wire for electric bonding | Gwang-Mun CHOI, Kwang-Seong Choi, Jiho JOO, Chanmi Lee, Ki Seok Jang | 2023-04-04 |
| 11488841 | Method for manufacturing semiconductor package | Kwang-Seong Choi, Ki Seok Jang, Seok-Hwan MOON, Jiho JOO | 2022-11-01 |
| 11107790 | Laser bonding method | Kwang-Seong Choi, KeonSoo JANG, Seok-Hwan MOON, Hyun Cheol Bae | 2021-08-31 |
| 10636761 | Method of fabricating a semiconductor package | Kwang-Seong Choi, Keon-Soo Jang, Seok-Hwan MOON, Hyun Cheol Bae, Ieeseul Jeong +1 more | 2020-04-28 |
| 9980393 | Pattern-forming method for forming a conductive circuit pattern | Kwang-Seong Choi, Hyun Cheol Bae, Jung Hyun Noh, Jong Tae Moon | 2018-05-22 |
| 9853010 | Method of fabricating a semiconductor package | Kwang-Seong Choi, Hyun Cheol Bae, Jin Ho Lee, Haksun LEE | 2017-12-26 |
| 9538666 | Bonding structure of electronic equipment | Kwang-Seong Choi, Hyun Cheol Bae, Haksun LEE | 2017-01-03 |
| 9490198 | Transmitting and receiving package | — | 2016-11-08 |
| 9462736 | Composition and methods of forming solder bump and flip chip using the same | Jong Tae Moon, Sangwon OH, KeonSoo JANG | 2016-10-04 |
| 9155236 | Composition and methods of forming solder bump and flip chip using the same | Jong Tae Moon, Sangwon OH, KeonSoo JANG | 2015-10-06 |
| 9034750 | Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same | Kwang-Seong Choi, Ho-eun Bae, Hyun Cheol Bae, Su Jeong Jeon | 2015-05-19 |
| 9006037 | Methods of forming bump and semiconductor device with the same | Kwang-Seong Choi, Hyun Cheol Bae, Haksun LEE | 2015-04-14 |
| 8802760 | Composition and methods of forming solder bump and flip chip using the same | Jong Tae Moon, Sangwon OH, KeonSoo JANG | 2014-08-12 |
| 8794502 | Method of forming solder on pad on fine pitch PCB and method of flip chip bonding semiconductor using the same | Kwang-Seong Choi, Jung Hyun Noh | 2014-08-05 |
| 8547278 | Sensing device having multi beam antenna array | Dong Suk Jun, Hyun Seo Kang, Moo Jung Chu, Soo Young Oh | 2013-10-01 |
| 8524571 | Vacuum wafer level packaging method for micro electro mechanical system device | Jong Tae Moon, Hyun Cheol Bae | 2013-09-03 |
| 8420722 | Composition and methods of forming solder bump and flip chip using the same | Jong Tae Moon, Sangwon OH, KeonSoo JANG | 2013-04-16 |
| 8211745 | Method and structure for bonding flip chip | Jong Tae Moon, Kwang-Seong Choi | 2012-07-03 |
| 8044757 | Electronic device including LTCC inductor | Hyun Cheol Bae, Kwang-Seong Choi, Jong Tae Moon, Moo Jung Chu, Jong Hyun Lee | 2011-10-25 |
| 8030200 | Method for fabricating a semiconductor package | Kwang-Seong Choi, Hyun Cheol Bae, Jong Hyun Lee, Jong Tae Moon | 2011-10-04 |
| 7985697 | Wafer level package and method of fabricating the same | Jong Tae Moon, Min Ji Lee, Hyun-Kyu Yu | 2011-07-26 |
| 7520682 | Transceiver module and optical bench for passive alignment | Jong Tae Moon, Ho-Gyeong YUN, Byung Seok Choi, Jong Hyun Lee | 2009-04-21 |