Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12349505 | Method of manufacturing electric device | Jiho JOO, Yong Sung EOM, Chanmi Lee, Gwang-Mun CHOI, Ki Seok Jang +2 more | 2025-07-01 |
| 12206056 | Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materials | Yong Sung EOM, Jiho JOO, Gwang-Mun CHOI, Seok-Hwan MOON, Chanmi Lee +1 more | 2025-01-21 |
| 11677060 | Method for transferring and bonding of devices | Jiho JOO, Yong Sung EOM, Gwang-Mun CHOI, Chanmi Lee, Ki Seok Jang | 2023-06-13 |
| 11618109 | Wire for electric bonding | Gwang-Mun CHOI, Yong Sung EOM, Jiho JOO, Chanmi Lee, Ki Seok Jang | 2023-04-04 |
| 11488841 | Method for manufacturing semiconductor package | Yong Sung EOM, Ki Seok Jang, Seok-Hwan MOON, Jiho JOO | 2022-11-01 |
| 11107790 | Laser bonding method | Yong Sung EOM, KeonSoo JANG, Seok-Hwan MOON, Hyun Cheol Bae | 2021-08-31 |
| 10636761 | Method of fabricating a semiconductor package | Yong Sung EOM, Keon-Soo Jang, Seok-Hwan MOON, Hyun Cheol Bae, Ieeseul Jeong +1 more | 2020-04-28 |
| 9980393 | Pattern-forming method for forming a conductive circuit pattern | Yong Sung EOM, Hyun Cheol Bae, Jung Hyun Noh, Jong Tae Moon | 2018-05-22 |
| 9853010 | Method of fabricating a semiconductor package | Hyun Cheol Bae, Yong Sung EOM, Jin Ho Lee, Haksun LEE | 2017-12-26 |
| 9538666 | Bonding structure of electronic equipment | Hyun Cheol Bae, Haksun LEE, Yong Sung EOM | 2017-01-03 |
| 9270381 | Method and apparatus for transmitting and receiving coherent optical OFDM | Chun Ju Youn, Yong-Hwan Kwon, Duk Jun Kim, Jong-Hoi Kim, Joong-Seon Choe +1 more | 2016-02-23 |
| 9034750 | Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same | Ho-eun Bae, Hyun Cheol Bae, Yong Sung EOM, Su Jeong Jeon | 2015-05-19 |
| 9031421 | Measuring device and method of measuring signal transmission time difference thereof | Joong-Seon Choe, Chun Ju Youn, Jong-Hoi Kim, Duk Jun Kim, Yong-Hwan Kwon +1 more | 2015-05-12 |
| 9024511 | Impact-type piezoelectric micro power generator | Chi Hoon Jun, Sang Choon Ko, Seok-Hwan MOON | 2015-05-05 |
| 9006037 | Methods of forming bump and semiconductor device with the same | Yong Sung EOM, Hyun Cheol Bae, Haksun LEE | 2015-04-14 |
| 8794502 | Method of forming solder on pad on fine pitch PCB and method of flip chip bonding semiconductor using the same | Yong Sung EOM, Jung Hyun Noh | 2014-08-05 |
| 8723292 | Silicon interposer including backside inductor | Hyun Cheol Bae, Jong Tae Moon, Jong Moon Park | 2014-05-13 |
| 8693459 | Polarization division multiplexed optical orthogonal frequency division multiplexing transmitter and receiver | Chun Ju Youn, Yong-Hwan Kwon, Jong-Hoi Kim, Joong-Seon Choe, Kyoungwoo Heo +1 more | 2014-04-08 |
| 8521040 | Optical orthogonal frequency division multiplexing receiver and optical signal receiving method thereof | Chun Ju Youn, Yong-Hwan Kwon, Eun Soo Nam, Jong-Hoi Kim, Joong-Seon Choe | 2013-08-27 |
| 8335200 | Device and method for separation/conversion of multiband signal | Yong-Duck CHUNG, Jae-Sik Sim, Yong-Hwan Kwon, Sung Bok Kim, Je Ha Kim | 2012-12-18 |
| 8272789 | Adapter assembly and method for compensating optical fibers for length difference | Joong-Seon Choe, Yong-Hwan Kwon, Chun Ju Youn, Jong-Hoi Kim, Eun Soo Nam | 2012-09-25 |
| 8211745 | Method and structure for bonding flip chip | Yong Sung EOM, Jong Tae Moon | 2012-07-03 |
| 8044757 | Electronic device including LTCC inductor | Hyun Cheol Bae, Yong Sung EOM, Jong Tae Moon, Moo Jung Chu, Jong Hyun Lee | 2011-10-25 |
| 8030200 | Method for fabricating a semiconductor package | Yong Sung EOM, Hyun Cheol Bae, Jong Hyun Lee, Jong Tae Moon | 2011-10-04 |
| 7733207 | Vertically formed inductor and electronic device having the same | Ho-Gyeong YUN, Jong Tae Moon | 2010-06-08 |