Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107790 | Laser bonding method | Kwang-Seong Choi, Yong Sung EOM, Seok-Hwan MOON, Hyun Cheol Bae | 2021-08-31 |
| 9462736 | Composition and methods of forming solder bump and flip chip using the same | Yong Sung EOM, Jong Tae Moon, Sangwon OH | 2016-10-04 |
| 9155236 | Composition and methods of forming solder bump and flip chip using the same | Yong Sung EOM, Jong Tae Moon, Sangwon OH | 2015-10-06 |
| 8802760 | Composition and methods of forming solder bump and flip chip using the same | Yong Sung EOM, Jong Tae Moon, Sangwon OH | 2014-08-12 |
| 8420722 | Composition and methods of forming solder bump and flip chip using the same | Yong Sung EOM, Jong Tae Moon, Sangwon OH | 2013-04-16 |