Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853010 | Method of fabricating a semiconductor package | Kwang-Seong Choi, Hyun Cheol Bae, Yong Sung EOM, Jin Ho Lee | 2017-12-26 |
| 9538666 | Bonding structure of electronic equipment | Kwang-Seong Choi, Hyun Cheol Bae, Yong Sung EOM | 2017-01-03 |
| 9006037 | Methods of forming bump and semiconductor device with the same | Kwang-Seong Choi, Yong Sung EOM, Hyun Cheol Bae | 2015-04-14 |