Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9034750 | Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same | Kwang-Seong Choi, Hyun Cheol Bae, Yong Sung EOM, Su Jeong Jeon | 2015-05-19 |