Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8951306 | Film-type supercapacitor and manufacturing method thereof | Jung Joon Yoo | 2015-02-10 |
| 7387910 | Method of bonding solder pads of flip-chip package | Woong Sun LEE | 2008-06-17 |
| 6902660 | Method of manufacturing printed circuit board and multi-layered PCB | Hyuek Jae Lee | 2005-06-07 |
| 6716738 | Method of fabricating multilayered UBM for flip chip interconnections by electroplating | Su-hyeon Kim, Jong-Yeon Kim | 2004-04-06 |
| 6110276 | Method for making n-type semiconductor diamond | Woong Sun LEE, Jung Keun Kim | 2000-08-29 |