Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7786590 | Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same | — | 2010-08-31 |
| 7755170 | Semiconductor device and semiconductor package having the same | Yeo Song Yun, Kyoung Sook Park | 2010-07-13 |
| 7629682 | Wafer level package configured to compensate size difference in different types of packages | Seung Taek YANG | 2009-12-08 |
| 7595552 | Stacked semiconductor package in which semiconductor packages are connected using a connector | — | 2009-09-29 |
| 7445961 | Semiconductor chip package and method for fabricating the same | — | 2008-11-04 |
| 7355287 | Semiconductor chip package and method for fabricating the same | — | 2008-04-08 |