Issued Patents All Time
Showing 25 most recent of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12410219 | Polypeptide derived from CAP1 and pharmaceutical composition comprising same as effective ingredient | Hyo-Soo Kim, Hyun Duk Jang | 2025-09-09 |
| 12296204 | Device for fixing rope for building cleaning | — | 2025-05-13 |
| 11413010 | Ultrasound diagnosis apparatus and method of operating the same | Sung-wook Park, Jin Yong Lee, Ji Hyun Yoon, Hyuk Chang, Namsik Chung +1 more | 2022-08-16 |
| 11360558 | Computer systems with finger devices | Paul X. Wang, Nicolai Georg, Benjamin R. Blachnitzky, Alhad A. Palkar, Minhazul Islam +14 more | 2022-06-14 |
| 11257801 | Stacked semiconductor package having mold vias and method for manufacturing the same | Hyung-Dong Lee, Eun Ko | 2022-02-22 |
| 11091515 | Polypeptide derived from CAP1 and pharmaceutical composition comprising same as effective ingredient | Hyo-Soo Kim, Hyun Duk Jang | 2021-08-17 |
| 10910349 | Stacked semiconductor chips having transistor in a boundary region | — | 2021-02-02 |
| 10771939 | Orientation of directional antennas using horizontal position information | Daniel Buchmueller, Ronald Joseph Degges, Jr., Jin Dong Kim, Gur Kimchi, Subram Narasimhan +1 more | 2020-09-08 |
| 10490530 | Stacked semiconductor chips having transistor in a boundary region | — | 2019-11-26 |
| 10447378 | Wireless mesh network for broadband connectivity | Jin Dong Kim, In Chul Hyun, Cheol Su Kim, Subram Narasimhan, Varadarajan Gopalakrishnan +1 more | 2019-10-15 |
| 10418353 | Stacked semiconductor package having mold vias and method for manufacturing the same | Hyung-Dong Lee, Eun Ko | 2019-09-17 |
| 10285262 | Pattern safety device for preventing interference between patterns | Ho Joon Lee, Hak Ryul Shin | 2019-05-07 |
| 10180595 | Display apparatus | Tae-hee Jeon, Dae-Young Kim, Jong Bin Kim, Gong Hee Lee, Jae Hak Cho +1 more | 2019-01-15 |
| 10149115 | Orientation of directional antennas using horizontal position information | Daniel Buchmueller, Ronald Joseph Degges, Jr., Jin Dong Kim, Gur Kimchi, Subram Narasimhan +1 more | 2018-12-04 |
| 10144676 | Aerogel composite and preparation method thereof | Young Soo Ahn, Jin Seok Lee, Chang Guk Hong, Bong Kwan SONG | 2018-12-04 |
| 10121118 | Confirming delivery of multiple packages to a delivery location using package tags | Jin Dong Kim | 2018-11-06 |
| 10090252 | Package-on-package type semiconductor device including fan-out memory package | Seung Taek YANG | 2018-10-02 |
| 10037256 | Electronic device having self diagnosis function and self diagnosis method using the same | Young-hun Choi, Hyun-Ho Kim, Ju-hyun Choe, Eun Young Kim, Ji Won Kim | 2018-07-31 |
| 10002850 | Semiconductor chip flexibly applied to various routing structures and semiconductor chip module using the same | Eun Ko, Yong Jae Park | 2018-06-19 |
| 9966359 | Semiconductor package embedded with a plurality of chips | Eun Ko, Yong Jae Park | 2018-05-08 |
| 9933424 | Human resistin receptor and use thereof | Young Bae Park, Hyo-Soo Kim, Yoo-Wook Kwon, Sahmin Lee, Hyun Chae Lee +2 more | 2018-04-03 |
| 9885911 | Display apparatus | Dae Hee Lee, Young-chol Lee, Byoung Jin Cho | 2018-02-06 |
| 9846854 | Smart electronic tracking tags with optimized power consumption | Jin Dong Kim | 2017-12-19 |
| 9793217 | Package-on-package type semiconductor device which is realized through applying not a TSV technology but a fan-out wafer level package technology | Seung Taek YANG | 2017-10-17 |
| 9780071 | Stacked semiconductor package including reconfigurable package units | Eun Ko, Yong Jae Park | 2017-10-03 |